High Temp Electronics Technology and Capabilities - Technical Capabilities

Our technical capabilities include:

• High Temperature Electronic Packaging (-55°C to 250°C)
• RF Electrical Design
• Substrate and PCB Layout Design for HI-REL applications
• Custom Metal and Ceramic (HTCC, LTCC) Package Design
• Multi-layer Thick-Film Substrate Fabrication (Al2O3, AlN, BeO)
• Hybrid Microcircuit Assembly and Test in Class 10K clean room environment
• CSP, Flip Chip & BGA Component Mounting
• Hermetic Package Sealing for HI-REL applications (Projection, Seam and Cold welds)
• Bare Die Procurement and Handling
• Quartz BAW Resonator Design & Fabrication (Round, Strip and HFF Inverted Mesa configurations)
• SAW Wafer Fabrication in Class 100 clean room environment
• Wafer deep etching technology for Wafer Level Packaging
• Process and Test Equipment Design
• Environmental MIL-PRF Screening
• Custom Process Equipment Design
• Physical Design Modeling and Finite Element Analysis

Finite Element Analysis