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High Temp Electronics Technology and Capabilities - Assembly Process

In order to withstand the harsh operating environment, high temperature electronic products are designed from the ground-up with the knowledge of advanced assembly processes as well as material science.

Using robust assembly techniques, Vectron offers the flexibility of applying a wide range of manufacturing processes to meet the customer’s unique application requirements and ensure the delivery of the highest quality product. Each run is intensely scrutinized during the process control and process automation phases of delivery.

Our Assembly Process include:
  • BAW/SAW Quartz Wafer Fabrication
  • Deep Wet Etching of Quartz Wafers
  • Thick-Film Substrate Fabrication
    • Al2O3, BeO, AlN, Multi-Layer
  • Component Attachment
    • Flip Chip, Eutectic die mount, fine-pitch SMT
  • Wirebonding
    • Al and Au wirebonding
  • Hermetic Sealing with Metal and Ceramic Packages
    • Projection, seam and cold welding


Packaging and Assembly